PERFORMANCE

Throughput

Up to 20,000 UPH (package and temperature dependent)

Index Time

In Line Contacting: x4: 800 ms / x8 1800 ms; Plunge: x4: 650ms (w/ 700ms test) / x8: 650 ms (w/ 1s test) package dependent

MCBJ

1:10,000; jam rates may vary based on package type and temperature

MTBF

>600 hours

MTTA

<10 minutes

APPLICATIONS

Package Types & Sizes

QFN (2 mm to 10 mm), SOIC, SSOP, TSSOP, MSOP, QSOP (and similar packages)

Test Sites

Octal 2x4, Quad 1x4, Quad 2x2, Octal Split Kit 2x2 & Quad Split 1x2

Package Conversion

4-8 hours mechanical changeover typical

Device Types

MEMS, High Voltage, Analog, RF, Digital, Automotive and others

ENVIRONMENTAL

Temperature Range

Ambient or ambient to +155°C or tri-temp: -55°C to +155°C

Accuracy

±1°C at test site and ±2°C in chamber

Cooling

LN2 or portable mechanical refrigeration

CONTACTORS/LOAD BOARDS

Socket Types

Accommodates standard, Kelvin and high performance

Test Site Pitch

60 mm x 60 mm, 60 mm x 36 mm

Backplane

Vertical: 43.4” (1102 mm) from centerline of lower test sites to floor

INPUT/OUTPUT AUTOMATION

Input Tube

Auto loader: tube stack height 15 inches (381 mm); unloader: 4 stack height 7 inches (178 mm) each

Magazine

Auto loader and unloader: 7 inches (178 mm) stack

Output Manual Tube/Magazine

Up to 8 programmable lanes for tube and up to 14 programmable lanes for magazine

TESTER INTERFACE

Standard Interface

RS-232 serial

Optional Tester Interface

GPIB & TTL Parallel

Test Modes

Parallel, Ping Pong

CONTROLS

Display

User GUI 15” LCD touch-screen monitor

PHYSICAL DIMENSIONS

Weight

1,350 lbs. (615 kg)

Height

78 inches (1,980 mm)

Footprint

40.5” (1,030 mm) x 38” inches (970 mm)

UTILITIES

Air Supply

Min. 80 PSI Dry Filtered Air, Handler - 4 SCFM, Thermal System – 14 SCFM, Purge for cold - 2 SCFM

Electrical

230 volts AC, single-phase 50/60 Hz.,1 amp normal with 3 amp surge, 15 amps at elevated temperature, 30 amps at tri-temp