Throughput

up to 12,000 units per hour (tray and package dependent)

MCBJ

1 in 12,000 units @ ambient and hot / 1 in 10,000 units @ cold

MTBF

600 hours

APPLICATIONS

Package Types

QFN, BGA, QFP, and other JEDEC tray-based packages

Package Sizes

3x3 mm to 35x35 mm / up to 50x50 mm optional

Changeover time

Kitless design / no change kits

TEST SITE

Parallelism

x1 to x32 / patterns from 1x1 to 4x8

Test Site Pitch

Compatible with existing pitches / wide flexibility in spacing

Index Time

x1 to x4: 550 ms / x8: 630 ms / x16: 800 ms / x32: 4100 ms

Docking

Horizontal, underneath, rear docking from three directions

Plunge Force

Up to 1250 lbs (566 kg)

Vision Alignment

Standard

INPUT/OUTPUT AUTOMATION

Media

JEDEC trays / color trays optional

I/O Configuration

Vertical tray stack / 95 tray capacity / flexible assignment of inputs and sort categories

Loading & Unloading

Continuous

TESTER INTERFACE

Tester Communication

RS 232 / GPIB / TTL

Docking Height

1000 - 1200 mm

Loadboards

compatible with existing loadboards

THERMAL

Temperature Range

-55°C to +155ºC / +175C optional

Temperature Accuracy

±3°C soak, / ±1°C test site

Thermal System

True chamberless soak and test site

Thermal Method

Conduction

Active Thermal Control

up to 30W / over 30W optional

Soak Capacity

The qty of packages contained in 4 - 6 JEDEC trays

ADDITIONAL CAPABILITIES

Auto Retest

Standard

Auto Contactor Cleaning

Optional

Double Device Detection

Standard, tray and socket

2D ID

Optional

Part Rotation

Standard

Compliance Standards

CE / SEMI S2 & S8 / UL (optional)

UTILITIES

Power

200-240 VAC / 3 phase / 30 amp with two (2) plugs

Air

Cold

LN2 or mechanical refrigeration unit